Abstract:

For printed circuit board (PCB)-based products where the components rely on PCB for electrical interconnection, hybrid combinatorial remanufacturing strategies are proposed based on the quality statuses and recovery options of recycled products, aiming to minimize remanufacturing costs by optimizing individual decisions and component utilization. To quickly generate and solve the optimization models, the disposal costs are accurately measured by logical operations of binary codes. Moreover, extensive numerical experiments are conducted to examine the applicability and effectiveness of the models and algorithms proposed. It is found that products with high material costs and low operating costs are suitable for hybrid combinatorial remanufacturing, which is consistent with the reality of consumer electronic products, where the factory-refurbished version is scheduled to go on sale as routine. The Inter-SKU combination proposed can be expected to reduce the cost by over 10% and 30% than the Inner-SKU combination and no combination, respectively, where the reuse of high-value chips contributes to the cost reduction. The remanufacturing strategies and algorithms proposed in this paper are helpful for manufacturers to achieve lean remanufacturing, improve the efficient use of resources, and promote the realization of China’s “dual carbon” goal.

Key words:

remanufacturing, modular product, recovery option, combinatorial optimization, Internet-of-things

摘要：

针对零部件依托印刷电路板（PCB）实现电气互联的不完全模块化产品，提出基于零件质量状态和处置选项的混合式组合再制造（HCR）策略，以处置成本最小化为目标构建再制造组合优化模型，实现个案处置和零件再利用的最优决策。为快速生成和求解优化模型，利用二进制编码逻辑运算提出精确计量处置成本的方法。通过大规模的数值实验，分析零件组合策略对于再制造的适用性和有效性，发现物料成本高但操作成本低的产品适合实施混合式组合再制造，这与现实中广泛存在的消费电子产品的官方翻新品实践一致。通过跨型号（Inter-SKU）组合再制造，相比同型号（Inner-SKU）组合与非组合可分别实现超过10%和30%的成本节约，其中高价值芯片的再利用是成本节约的来源。本文所提出的再制造策略和算法有利于企业的精益再制造，实现资源有效利用，助推我国“双碳”目标的实现。

关键词:

再制造, 模块化产品, 处置选项, 组合优化, 物联网